A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) µ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to an underlying Si bus waveguide.
High accuracy transfer printing of single-mode membrane silicon photonic devices
Sorel M.;
2018-01-01
Abstract
A transfer printing (TP) method is presented for the micro-assembly of integrated photonic devices from suspended membrane components. Ultra thin membranes with thickness of 150nm are directly printed without the use of mechanical support and adhesion layers. By using a correlation alignment scheme vertical integration of single-mode silicon waveguides is achieved with an average placement accuracy of 100±70nm. Silicon (Si) µ-ring resonators are also fabricated and show controllable optical coupling by varying the lateral absolute position to an underlying Si bus waveguide.File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.